JPS6379644U - - Google Patents
Info
- Publication number
- JPS6379644U JPS6379644U JP17424486U JP17424486U JPS6379644U JP S6379644 U JPS6379644 U JP S6379644U JP 17424486 U JP17424486 U JP 17424486U JP 17424486 U JP17424486 U JP 17424486U JP S6379644 U JPS6379644 U JP S6379644U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- die bonding
- bonding
- lead frame
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17424486U JPS6379644U (en]) | 1986-11-12 | 1986-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17424486U JPS6379644U (en]) | 1986-11-12 | 1986-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379644U true JPS6379644U (en]) | 1988-05-26 |
Family
ID=31112444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17424486U Pending JPS6379644U (en]) | 1986-11-12 | 1986-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379644U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57112043A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Pick up apparatus for object |
-
1986
- 1986-11-12 JP JP17424486U patent/JPS6379644U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57112043A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Pick up apparatus for object |